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Dear Prospective Commercial Supporters of IEEE MEMS 2016,

As General Chairs of the 29th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2016), we would like to formally invite you to participate as a member of the MEMS Benefactor Group. The Conference will be held at the Shanghai International Convention Center (SHICC), January 24 - 28, 2016, in Shanghai, China. We anticipate over 600 academic and industrial engineers and scientists from around the world to attend.

Covering the highest quality research and development on micro devices and systems, IEEE MEMS 2016 is totally self-supporting and relies on contributions and tuition to offset all expenses. The goal of the MEMS Benefactor Group is to assist in keeping the tuition rate as low as possible, which should enhance the potential number of participants being able to attend.

There are various levels of involvement to participate as a member of the MEMS Benefactor Group. Parallel to the Technical Program is an exhibit area displaying products and services relevant to researchers in the MEMS field, i.e. vendors of books and journals, processing equipment, test equipment, materials, CAD tools, or MEMS design, foundry and test services. If not interested in becoming an exhibitor, your company or institute might be interested in becoming a patron of IEEE MEMS 2016.

As the flagship meeting in the field, the MEMS Conference attracts world leaders in MEMS by offering a top quality, single session technical program of the current state-of-the-art papers combined with networking opportunities. This is a great opportunity to expose your company to the key players of MEMS and introduce your equipment, materials, and services to the potential users from all over the world in one place.

We are looking forward to another successful conference in 2016 and hope that your company will seriously consider participating as an MEMS Benefactor Group Member.

We look forward to seeing you in January 2016 in Shanghai!

Hiroshi Toshiyoshi
Conference Chair
University of Tokyo, Japan
                           Xiaohong Wang
                        Conference Chair
          Tsinghua University, China